EV Battery adhesive Solutions

Lợi ích

H.B. Fuller is prepared to help EV manufacturers with the latest adhesive and sealant technology, providing turnkey solutions to improve the reliability and safety of battery packs. On the battery module, we provide solutions for cell to carrier, cell to cold plate, battery and structural bonding of enclosures, fire protection encapsulation, dielectric coatings, thermally conductive, and TIM solutions. For battery packs, we provide resealable, FIP and CIP gaskets, and flame insulation bonding. Similar to the general automotive industry, we offer bonding for body structures, adhesives for powertrain, battery pack/module structural applications.

As the technology for electric vehicles (EVs) evolves to become more practical and cost-effective, manufacturing EVs will require a well-tooled supply chain with cutting-edge electric vehicle adhesive and sealant solutions. That means EV manufacturers won’t just need solutions that are proven to work — they’ll need a solution partner willing to innovate and break through boundaries. At H.B. Fuller, we thrive on solving challenges. Just bring your electric vehicle adhesive challenge to us, and we’ll handle the rest

H.B. Fuller's EV products typically	Typical applications areas EV products are
High reliability and excellent aging resistance Thermal shock Various material Low density, low modulus Reworkability versus reliability balance Excellent flame retardant performance Excellent vibration and shock resistance performance	Structural bonding Thermal conductive adhesive Gap filler Form material for fire protection CIPG/FIPG PCB assembly

H.B Fuller Structural Bonding

Product	Description	Chemistry	Color	Viscosity @ 25°C(cPs)	Mix Ratio	Pot Life @25°C (min)	Lap Shear Strength (MPa)	Shelf Life @ 8-25°C (Months)
H.B Fuller EV Bond 319	Excellent bonding, electrical insulation, water resistance, corrosion resistance and impact resistance properties	Polyurethane	A:Black B:Yellowish	A:50,000 B:20,000	1:1	45	11	6
H.B Fuller EV Bond 700 FR	UL94-V0 rating flame retardant performance Low viscosity PSA for precise applications Low add-on weight, and thin thickness. Can be applied via spray, standard extrusion, roll coating	SBC	White	3,500-4,000 @148°C	NA	NA	6.5	12
H.B Fuller EV Bond 775	High green strength allows immediate handling processing and testing Excellent adhesion to a diverse selection of substrates	SBC	Yellow	7,500-12,000 @150°C	NA	15	4.5	6
H.B Fuller EV Bond 707	Good low-temperature flexibility Thermal and solvent resistance Low modulus/high impact strength Very high strength in open state Excellent heat stability	SBC	Light Yellow	3,000-7,000 @195°C	NA	NA	0.5	12

Sealant

Product	Description	Chemistry	Color	Viscosity@ 25°C(cPs)	Tack-free Time (min)	Hardness (Shore)	Lap Shear Strength (MPa)	Shelf Life @ 8-25°C (Months)
H.B Fuller EV Seal 662	Good adhesion to glass, plastic and metal Good flexibility Fast UV curing	Modified Acrylate	Semi-transparent	30,000	6s @100mW/cm² 365nm	A 35	3.0	12
H.B Fuller EV Seal 500	Preformed gasket seal Easy disassembly, easy repair Excellent aging resistance	SBC	Gray	32,000 @200°C	NA	NA	0.1	12
H.B Fuller EV Seal 200	Excellent high and low temperature resistance Excellent moisture resistance Excellent environmental aging resistance	MS	Black/White	Paste	10	A 55	3.5	6
H.B Fuller EV Seal 298	100% solid content Good bonding strength and low modulus Excellent thermal shock performance Superior durability to heat and moisture	2K MS	A:Yellowish B:Black	A:50,000-70,000 B:20,000-40,000	NA	A75-80	6.5	6

Thermal Conductive Adhesive

Product	Description	Chemistry	Color	Mix Ratio	Viscosity @ 25°C(cPs)	Pot Life @25°C (min)	Thermal Conductive (W/m.K)	Shelf Life @ 8-25°C (Months)
H.B Fuller EV Therm 805	High thermal conductive Easy operation Heating accelerates the reaction Low stress Excellent insulating property	Silicone	White	1K	Paste	Tack-free time: 5min @25°C	1.2	6

Thermal Gap Filler

Product	Description	Chemistry	Color	Mix Ratio	Viscosity @ 25°C(cPs)	Pot Life @25°C (min)	Thermal Conductive (W/m.K)	Shelf Life @ 8-25°C (Months)
H.B Fuller FS5003	Non-curable High thermal conductive Dielectric properties Low volatility, Low bleed	Silicone	Gray	1K	550,000	NA	3.5	9
H.B Fuller FS5500	High thermal conductive Easy operation Heating accelerates the reaction Low stress Excellent insulating property	Silicone	White	1K	Paste	30min @100°C	3.6	6
H.B Fuller FS5004H	Non-curable High thermal conductive Dielectric properties Low volatility, Low bleed	Silicone	Pink	1K	Paste	NA	4	9
H.B Fuller FS5436	High thermal conductive Dielectric properties Low volatility, Low bleed, Low stress	Silicone	A: Blue B: White	1:1	A: 80,000 B: 60,000	30min @100°C	3.6	6
H.B Fuller FS5420	Silicon-free Good adhesion on many substrates Excellent aging resistance	MS	White	1:1	Paste	30	2	6
H.B Fuller EV Therm 288	Silicone-Free High thermal conductivity Plasticizer Free Low bond Strength	MS	Grey	1:1	Paste	300	2.1	6
H.B Fuller 3306-220	2k PU gap filler High thermal conductivity Short handling time High bonding strength Long elongation	Polyurethane	A: Yellow B: Blue Mixed: Green	1:1 by volume	300,000~500,000	>45	2	6

Foam Material

Product	Description	Color	Viscosity@ 25°C(CPs)	Mix ratio	Pot Life @25°C (min)	Tack-free Time @25°C(min)	Hardness (Shore)	Shelf Life @ 8-25°C (Months)
H.B Fuller EV Protect 4006	Low odor, no corrosion Low viscosity, fast filling Low density Excellent impact resistance Flame retardant	A:Off-white B:Clear Amber	A: 500 B: 160	5:4	120	60	A 40	12
H.B Fuller EV Protect 5006	Low viscosity, self leveling Excellent seismic and impact resistance No outgassing of Hydrogen gas during curing Flame retardant	A:Gray B:Clear Amber	A: 700 B: 150	5:4	120	60	A 55	12
H.B Fuller EV Protect 3027	Low odor, no corrosion Low viscosity, fast filling Low density Excellent impact resistance High hardness, high compressive strength	A:Off-white B:Clear Amber	A: 1,150 B: 350	1:1	240	30	D 42	6

PCB Assembly Material

Product	Description	Chemistry	Color	Viscosity@ 25°C(CPs)	Cure Schedule	Tg (°C)	Shelf Life @ 8-25°C (Months)
H.B Fuller FH8709T	Good dispensing performance and shape retention Low CTE Good reliability	Epoxy	Black	41,280	5min @120°C	163	6 @2-8°C
H.B Fuller FH8307	Suitable for variety of IC packages, BGA/CSP, SIP High Tg, low CTE Withstand lead-free reflow, after exposed to JEDEC level II	Epoxy	Black	4,800	8min @150°C	166	6 @-20°C
H.B Fuller FH8028	Reworkable without damage to the attach pad High reliability design	Epoxy	Black	400	8min @150°C	125	6 @-20°C
H.B Fuller EA6439	Low modulus to prevent warpage High and low temperature resistance	Acrylate	Light Blue	8,000	UV 200mW/cm² (365nm LED) + 10min @130°C	15	6 @-20°C
H.B Fuller FS3006	1:1 2K silicone potting adhesive Thermal conductivity 0.6 W/m.K Excellent aging resistance and thermal resistance	Silicone	A: Black B: Beige	A:14,000 B:9,000	30min @50°C 24 h@25°C	NA	6
H.B Fuller EA6106L	Handling possible immediately after UV curing Excellent mechanical and climatic resistance Excellent protection against corrosion of PCB	Modified Acrylate	Light Yellow (Fluorescence)	70	UV/Moisture UV 1500mJ/cm²	NA	6 @8-25°C
H.B Fuller EA6103	Low odor, environmentally friendly Easy to rework, suitable for a variety of process requirement Excellent aging resistance	Solvent-base Acrylate	Clear (Fluorescence)	30	Tack-free time: 10min @25°C Full cure time: 24h @25°C	NA	12 @8-25°C
H.B Fuller EU2002	Low odor, environmentally friendly Excellent chemical resistance Excellent insulating property	Solvent-base Alkyd	Brown (Fluorescence)	80	Tack-free time: 30min @25°C Full cure time: 48h @25°C	NA	6 @8-25°C
H.B Fuller FS3000	Solvent-free Excellent weather resistance, dielectric property Reworkable	Silicone	Translucent (Fluorescence)	800	Tack-free time: 15min @25°C Full cure time: 24h @25°C	NA	6 @8-25°C