H.B Fuller Reactive Hot Melt Adhesive
H.B. Fuller’s line of reactive hot melt adhesives includes products that are specifically designed for mobile device assembly. Our products are designed to cover a broad spectrum of applications touch panel assembly to mobile phone parts bonding, by providing a range of performance characteristics including impact, chemical, moisture, and temperature resistance.
Some of these products have gasket-like properties, which provide outstanding sealing and protecting capability for electrical and electronic devices moisture, water, oils, and contaminants such as dust.
Other products are specially formulated for applications that require reworkability of an assembly. These materials combine high performance and reliability with mechanisms to remove the adhesive and reuse the components.
Our reactive hot melt adhesives offer
• Robust, tough, single-component construction
• Near instantaneous bond strength
• Adhesion to a wide variety of substrates
• Resistance to chemicals, fuels and oils
• Low MVTR (superior moisture resistance)
• Formation of a resilient, tough polymer after cure, but can also be flexible
• Ultra fast curing materials available
Product | Description | Color | Viscosity at Application Temperature (cPs) | Open Time (min) | Cure Time (hrs) | OLSS, PC-PC (MPa) |
---|---|---|---|---|---|---|
EH9641 | Ultra fast curing Suitable for most substrates |
Light Yellow | 3,700 @ 110°C | 2.5 | 24 | 8.3 |
EH9650 | General purpose Excellent adhesion on most of substrates Capable of narrow edge bonding |
Light Yellow | 3,700 @ 110°C | 4 | 24 | 8.9 |
EH9652BH | Excellence impact performance Narrow frame bonding |
Black | 4,800 @ 120°C | 4 | 24 | 10 |
EH9656 | Excellent reliability performance on plastic and metal to substrates Fast curing speed |
Light Yellow | 2,300 @ 120°C | 3 | 24 | 8.4 |
EH9303B | Excellence creep resistance Excellence combination property Narrow frame bonding |
Black | 3,000 @ 120°C | 4 | 24 | 6 |
EH9672 | High reliability and excellent reworkability Excellent adhesion on most of substrates Long open time |
Light Yellow | 2,500 @ 120°C | 15 | 24 | 8.3 |
EH9686 | General purpose Excellent adhesion on most of substrates Good thermal resistance |
Light Yellow | 5,500 @ 120°C | 8 | 24 | 6.6 |
EH9306B | High green strength Excellence reliability performance |
Black | 4,500 @ 120°C | 4 | 24 | 7 |
EH9305 | High green strength High reliability High Impact resistance |
Light Yellow | 4,300 @ 120°C | 4 | 24 | 7 |
EH9622BLV | Excellent adhesion on most of substrates Low modulus |
Black | 3,900 @ 120°C | 4 | 24 | 6 |
EH9308B | Excellent adhesion on most of substrates Excellence chemical resistance |
Black | 3,500 @ 120°C | 4 | 24 | 11 |
EH9900B | High green strength High reliability Easy rework |
Black | 4,500 @ 120°C | 6 | 24 | 7 |
EH9920B | OLED screen light hide Low modulus Low moisture permeability |
Black | 2,500 @ 120°C | 8 | 24 | 13 |
EH9923B | LCD screen light hide Fast setting |
Black | 800 @ 120°C | 1 | 24 | 7 |