Created by potrace 1.16, written by Peter Selinger 2001-2019

H.B Fuller Reactive Hot Melt Adhesive

Lợi ích

H.B. Fuller’s line of reactive hot melt adhesives includes products that are specifically designed for mobile device assembly. Our products are designed to cover a broad spectrum of applications touch panel assembly to mobile phone parts bonding, by providing a range of performance characteristics including impact, chemical, moisture, and temperature resistance.

Some of these products have gasket-like properties, which provide outstanding sealing and protecting capability for electrical and electronic devices moisture, water, oils, and contaminants such as dust.

Other products are specially formulated for applications that require reworkability of an assembly. These materials combine high performance and reliability with mechanisms to remove the adhesive and reuse the components.

Our reactive hot melt adhesives offer

• Robust, tough, single-component construction

• Near instantaneous bond strength

• Adhesion to a wide variety of substrates

• Resistance to chemicals, fuels and oils

• Low MVTR (superior moisture resistance)

• Formation of a resilient, tough polymer after cure, but can also be flexible

• Ultra fast curing materials available

Product Description Color Viscosity at Application Temperature (cPs) Open Time (min) Cure Time (hrs) OLSS, PC-PC (MPa)
EH9641 Ultra fast curing
Suitable for most substrates
Light Yellow 3,700 @ 110°C 2.5 24 8.3
EH9650 General purpose
Excellent adhesion on most of substrates
Capable of narrow edge bonding
Light Yellow 3,700 @ 110°C 4 24 8.9
EH9652BH Excellence impact performance
Narrow frame bonding
Black 4,800 @ 120°C 4 24 10
EH9656 Excellent reliability performance on plastic and metal to substrates
Fast curing speed
Light Yellow 2,300 @ 120°C 3 24 8.4
EH9303B Excellence creep resistance
Excellence combination property
Narrow frame bonding
Black 3,000 @ 120°C 4 24 6
EH9672 High reliability and excellent reworkability
Excellent adhesion on most of substrates
Long open time
Light Yellow 2,500 @ 120°C 15 24 8.3
EH9686 General purpose
Excellent adhesion on most of substrates
Good thermal resistance
Light Yellow 5,500 @ 120°C 8 24 6.6
EH9306B High green strength
Excellence reliability performance
Black 4,500 @ 120°C 4 24 7
EH9305 High green strength
High reliability
High Impact resistance
Light Yellow 4,300 @ 120°C 4 24 7
EH9622BLV Excellent adhesion on most of substrates
Low modulus
Black 3,900 @ 120°C 4 24 6
EH9308B Excellent adhesion on most of substrates
Excellence chemical resistance
Black 3,500 @ 120°C 4 24 11
EH9900B High green strength
High reliability
Easy rework
Black 4,500 @ 120°C 6 24 7
EH9920B OLED screen light hide
Low modulus
Low moisture permeability
Black 2,500 @ 120°C 8 24 13
EH9923B LCD screen light hide
Fast setting
Black 800 @ 120°C 1 24 7
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