H.B Fuller Thermal Conductive Material
Effective control of heat is an increasing concern among today’s electronic device manufacturers and, as products become smaller, the need to dissipate damaging heat effectively will be greater than ever. Yet, improved thermal management is increasingly critical to maintaining the long-term performance and reliability of PCB system assemblies in virtually every industry. H.B. Fuller's thermal conductive products provide the best solutions for non-conductive applications and meet the long-term performance requirements of components.
H.B. Fuller thermal conductive offer:
- For different applications, there are potting, bonding, gap filling and other materials to choose from
- Low, medium and high thermal conductivity are suitable for different thermal conductivity needs
- Easy to dispense and easy to rework
- Excellent aging resistance (high and low temperature impact, high temperature and high humidity, salt spray test, etc.) Non-corrosive, suitable for PCB, FPC and other precision occasions
- Low stress, low bleed, low thermal resistance, high stability
| Product | Description | Chemistry | Color | Mix Ratio | Viscosity @ 25°C (cPs) | Cure Schedule | Thermal Conductive (W/m·K) | Shelf Life @ 25°C (months) |
|---|---|---|---|---|---|---|---|---|
| FH8536 | Low viscosity, good infiltration Excellent toughness and good electrical properties Resistant to high and low temperature impact |
Epoxy | A: Black B: Yellow |
4:1 | A: 50,000 B: 300 |
1h @95°C +2 h@120°C |
0.8 | 6 |
| FS3006 | Excellent aging resistance and thermal resistance |
Silicone | A: Black B: Beige |
1:1 | A: 4,000 B: 2,000 |
30min @50°C 24 h@25°C |
0.6 | 6 |
| FS5621 | Medium thermal conductive Good flowability, easy dispensing |
Silicone | A: Black B: White |
1:1 | A: 6,000 B: 4,500 |
30min @80°C 24 h@25°C |
2.1 | 6 |
| FS5635 | High thermal conductive Stable performance Excellent aging resistance |
Silicone | A: Black B: White |
1:1 | A: 14,000 B: 9,000 |
30min @80°C 24 h@25°C |
3.5 | 6 |
| FS5005 | Low odor, Medium thermal conductive Non-corrosive to metals Excellent adhesion to many substrates |
Silicone | White | 1K | Paste | Tack-free time: 5min @25°C | 1.2 | 6 |
| EU2081T | Medium thermal conductive High bonding strength Low specific gravity |
Polyurethane | A: Black B: Yellow |
1:1 | A: 60,000 B: 160,000 |
Open time: 10min @25°C | 1.5 | 6 |
| FS5820 | Medium thermal conductive Weather and high temperature resistance Low odor, alcohol type |
Silicone | White | 1K | Paste | Tack-free time: 3min @25°C | 1.8 | 9 |
| FS5828 | High thermal conductive Excellent aging resistance |
Silicone | White | 1K | 150,000 | Tack-free time: 10min @25°C | 2.8 | 6 |
| TC300G | Non-curing and non-flowing thermally conductive compound High thermal conductivity Good insulation |
Silicone | Gray | 1K | Paste | NA | 2.5 | 12 |
| FS5003 | Non-curable High thermal conductive Dielectric properties Low volatility, Low bleed |
Silicone | Gray | 1K | 550,000 | NA | 3.5 | 9 |
| FS5004H | Non-curable High thermal conductive Dielectric properties Low volatility, Low bleed |
Silicone | Pink | 1K | Paste | NA | 4.0 | 9 |
| FS5500 | High thermal conductive Easy operation Heating accelerates the reaction Low stress Excellent insulating property |
Silicone | White | 1K | Paste | 30min @100°C | 3.6 | 6 |
| FS5420 | Silicone-free Good adhesion on many substrates Excellent aging resistance |
MS | White | 1:1 | Paste | 24 h @25 °C | 2.0 | 6 |