H.B.Fuller Acoustic Assembly

Lợi ích

H.B. Fuller offers a wide range of assembly and protection materials for challenging and various acoustic application requirements. Our products are specifically designed to cover a broad spectrum of acoustic applications to meet the strict dispensing requirements while providing excellent performance, enhancing process efficiency and lowering the total manufacturing cost to acoustic devices manufacturers

Acoustic Assembly

Our high performance solutions for acoustics includes but not limited by the applications:

House structure bonding
Gap sealing
Magnet system bonding
Membrane-frame bonding
FPC & chip protection

H.B. Fuller Acoustic Assembly

Product	Description	Color	Cure Schedule	Tg (°C)	CTE alpha 1 (ppm)	Pot Life @ 25°C (hrs)	Shelf Life (Months)	Viscosity @ 25°C (cPs)
H.B. Fuller FH8731	Disigned for wirebond chip glob top	Black	20 min @ 150°C	129	58	72	12 @ 2 - 8°C	36,400
H.B. Fuller FH8732	Disigned for wirebond chip glob top, Low CTE	Black	30 min @ 125°C + 90 min @ 165°C	95	17	8	6 @ -40°C	35,000
H.B. Fuller FH8733	Disigned for wirebond chip glob top, Medium flow	Black	90 min @ 120°C + 60 min @130°C	124	42	72	6 @ 8-25°C	90,000
H.B. Fuller FH8733L	Disigned for wirebond chip glob top, Low glob-top	Black	90 min @120°C	122	43	72	6 @ 8-25°C	45,000
H.B. Fuller FS2116	General purpose, Suitable for sealing and component reinforcenment	White	48h @25°C	NA	NA	NA	6 @ 8-25°C	9,000
H.B. Fuller FS2117	High flexibility and toughness	Light Yellow	48h @25°C	NA	NA	NA	6 @ 8-25°C	Paste
H.B. Fuller UV103	Good aging resistance, Excellent adhesion	Light Blue	UV 1,500mJ/cm2 (365nm) + 10min @130°C	NA	NA	NA	12 @ 8-25°C	50,000
H.B. Fuller EA6439	Low modulus for low stress and impact resistance, Good flux compatibility, Good SIR performance	Light Yellow	UV 200mW/cm2 (365nm LED) + 15 min @130°C	NA	NA	NA	6 @ -20°C	8,000