H.B Fuller Biometric Sensors and Camera Modu
Biometric sensors and camera modules for handheld devices, such as smart phones and tablets, are constantly evolving, which enables handheld device manufacturers to differentiate their products in the market place. This fast moving, innovative market consistently needs better and more sophisticated adhesive technologies to help deliver existing and next generation camera module bonding solutions.
With our comprehensive innovative adhesives solutions, we can provide to the image sensor market:
- One component, premixed adhesives with long RT work life
- Industry leading thermal cure kinetics offering lower temperature cure at short cure times
- UV command cure solutions
- High adhesion to a variety of substrates, including glass, metals and common low temperature stability plastics (PC, LCP, PA, PBT and PPA)
- High reliability
- Low shrinkage
- Low stress
- Easy processing liquid paste solutions
- Controlled flow solutions
Bonding applications in camera modules and image sensors:
- Active alignment process
- House bonding
- Die attach
- IR glass attach
- VCM assembly
- Flip chip side fill
- Lens/Lens barrel fixing
- Encapsulation
- FPC reinforcement
- Conductive grounding
| Product | Description | Color | Viscosity @ 25°C (cPs) | Cure Schedule | Pot Life @ 25°C (days) | Shelf Life (Months) |
|---|---|---|---|---|---|---|
| H.B Fuller FH8808 | Low warpage, low stress Low outgassing Low temperature fast cure High bonding strength |
Red | 18,730 | 180s @ 110°C | 1 | 6 @ -20°C |
| IR Filter bonding | ||||||
| H.B Fuller FH8633T | Very fast curing at low temperature High bond strength on a variety of substrates Excellent thermal performance |
Black | 24,890 | 5min @ 80°C | 3 | 6 @ -20°C |
| H.B Fuller FH8636L | Very fast curing Medium viscosity, low bleeding Excellent thermal performance |
Black | 17,000 | 10min @ 80°C | 3 | 6 @ -20°C |
| UV Heat Solution for Image Sensor Assembly | ||||||
| H.B Fuller EA6405 | High Tg for high aspect ratio dispensing Excellent adhesion to plastics and metals |
White/Beige | 520,000 | UV 2,000 mJ/cm2 (365nm) + 3 h @ 60°C |
2 | 6 @ -40°C |
| H.B Fuller EA6407 | Superior adhesion to a wide range of substrates High Tg for high temperature reliability |
Black | 35,000 | UV 6,000 mJ/cm2 (365 nm) + 60 min @ 80°C |
2 | 6 @ -40°C |
| H.B Fuller EA6412 | Excellent bond strength to LCP for both UV initial and full cure High Tg for high aspect ratio dispensing Low shrinkage |
Black | 52,700 | UV 4,000 mJ/cm2 (365 nm) + 30 min @ 80°C |
3 | 6 @ -40°C |
| H.B Fuller EA6414 | Good bond strength on LCP, PA, FR4, metal, and other engineering grade materials Excellent flexibility Good high temperature high humidity resistance |
Slight Yellow | 7,000 | UV 6,000 mJ/cm2(365 nm LED) + 60 min @60°C |
3 | 6 @ -40°C |
| H.B Fuller EA6416 | Good bond strength on LCP, PA, FR4, metal, and other engineering grade materials Excellent flexibility High aspect ratio |
Dark Gray | 48,210 | UV 4,000 mJ/cm2(365 nm LED) + 30 min @ 80°C |
3 | 6 @ -40°C |
| H.B Fuller EA6417B | Good bond strength on LCP, PA, FR4, metal, and other engineering grade materials Excellent flexible Excellent bond strength to LCP for both UV initial and full cure |
Black | 45,560 | UV 4,000 mJ/cm2(365 nm LED) + 60 min @ 80°C |
3 | 6 @ -40°C |
| H.B Fuller EA6419 | High Tg for high aspect ratio dispensing Low viscosity for good flow, nozzle dispensing |
Black | 14,450 | UV 4,000 mJ/cm2 (365 nm) + 30 min @ 90°C |
3 | 6 @ -40°C |
| Lens Holder to Substrate(House bonding) | ||||||
| H.B Fuller FH8627M | Excellent strength to low surface energy PCB | Black | 20,000 | 10min @ 80°C | 3 | 6 @ -20°C |
| H.B Fuller FH8633T | Very fast curing at low temperature High bond strength on a variety of substrates |
Black | 24,890 | 5min @ 80°C | 3 | 6 @ -20°C |
| H.B Fuller FH8633TB | Very fast curing Excellent thermal performance |
Black | 12,540 | 10min @ 80°C | 3 | 6 @ -20°C |
| H.B Fuller FH8636 | Very fast curing Low bleeding Excellent thermal performance |
Black | 24,890 | 10min @ 80°C | 3 | 6 @ -20°C |
| H.B Fuller FH8640P | Low modulus to prevent warpage Non-conductive High and low temperature resistance |
Black | 13,570 | 30min @ 80°C | 3 | 6 @ -20°C |
| Product | Description | Color | Viscosity @ 25°C (cPs) | Cure Schedule | Pot Life @ 25°C (days) | Shelf Life (Months) |
| Motion System Bearing Bonding | ||||||
| H.B Fuller FH8622S | Low modulus to prevent warpage Non conductive, non corrosive Fungus-resistance |
Black | 9,763 | 10min @ 80°C 20min @ 75°C |
9 | 6 @ -20°C |
| H.B Fuller FH8602NB | Low modulus to prevent warpage Non conductive, non corrosive |
White | 360,000 | 5min @ 80°C 20min @ 70°C |
14 | 6 @ -20°C |
| Conductive Material Solution | ||||||
| H.B Fuller FH8801C | High bond strength on a variety of substrates Suitable for fine pattern dispensing Low outgassing, Low Stress High thermal stability |
Silver | 23,540 | 90s @ 110°C 60 min @ 85°C |
1 | 12 @ -40°C |