H.B Fuller Epoxy Adhesive
The general trend in the advance electronic materials industry is moving toward smaller, lighter, thinner, fast and more reliable products. To deliver lighter less bulky electronic devices with ever greater processing power is a significant challenge. Electronic device manufacturers need to utilize non-traditional metal, glass and plastic materials in construction of their products, which requires reduced application temperature during the assembly process. To ensure integrity and reliability throughout the working life of electronic devices, high-reliability protective products increase the life of electronic devices.
The general trend in the advance electronic materials industry is moving toward smaller, lighter, thinner, fast and more reliable products. To deliver lighter less bulky electronic devices with ever greater processing power is a significant challenge. Electronic device manufacturers need to utilize non-traditional metal, glass and plastic materials in construction of their products, which requires reduced application temperature during the assembly process. To ensure integrity and reliability throughout the working life of electronic devices, high-reliability protective products increase the life of electronic devices.
H.B. Fuller’s products for low temperature cure applications offe
- One part, adhesives with long work life
- Long shelf life at -20°C storage or blow
- Industry-leading, thermal cure kinetics, offering lower temperature cure at short cure time
- High adhesion to a variety of substrates
- High reliability and thermal resistance
- Low stress
- High elongation
- Easy to processing liquid, paste and film solutions
H.B. Fuller’s products for heat cure applications offer
- High reliability (drop, shock, autoclave and temperature cycle)
- Fast flow and easy processing Reworkable versus reliability balance Excellent flux compatibility
- High reliability edge bond
- Good surface insulation resistance (SIR)
Low temperature cure adhesives for bonding applications are
- Camera modules and image sensors
- Finger print sensors
- LED lens boding
- Touch panels
- Wearable device assembly
- Electrical and component assembly
Heat cure adhesives for bonding applications are
- Wafer Level Chip Scale Package (WLCSP)
- Ball Grid Array（BGA）
- Chip Scale Packages（CSPs）
| Low Temperature Cure Adhesive |
Description | Color | Viscosity @ 25°C (cPs) |
Cure Schedule | Pot Life @ 25°C (days) |
Shelf Life @ -20°C (months) |
|---|---|---|---|---|---|---|
| FH8602 | Good jetting performance Low shringe |
White | 8,200 | 5min @ 80°C 15min @ 70°C |
3 | 6 |
| FH8620 | Low temperature cure and high bonding strength Stencil printable |
Black | 35,000 | 20min @ 80°C 50min @ 70°C |
3 | 6 |
| FH8621L | Excellent toughness Low viscosity, self-levelling Good bonding strength to PA and LCP |
Black | 6,500 | 10min @ 80°C | 3 | 6 |
| FH8623M | Good thermal resistance High adhsion to variety substrate |
White | 12,500 | 5min @ 80°C 10min @ 75°C |
3 | 6 |
| FH8632 | Design for migrant bonding Fluorescence indicator High bond strength on a variety of substrates Excellent thermal performance |
Black | 25,000 | 30min @ 80°C | 3 | 6 |
| FH8632M | Design for migrant bonding Fluorescence indicator High bond strength on a variety of substrates Excellent thermal performance |
Black | 10,080 | 30min @ 80°C | 3 | 6 |
| FH8633LV | Low viscosity Excellent thermal performance |
Black | 6,826 | 30min @80°C | 3 | 6 |
| FH8633T | Very fast curing at low temperature High bond strength on a variety of substrates |
Black | 24,890 | 5min @ 80°C | 3 | 6 |
| FH8633TB | Very fast curing Excellent thermal performance |
Black | 12,540 | 10min @80°C | 3 | 6 |
| FH8634 | Ultra fast curing magnet bonding adhesive Fluorescent property for easy auto optical inspection |
Black | 14,000 | 5min @ 80°C | 3 | 6 |
| FH8634FC | Very fast curing High bond strength on a variety of substrates Excellent thermal performance |
Black | 10,880 | 5min @ 80°C | 3 | 6 |
| FH8636 | Very fast curing Low bleeding Excellent thermal performance |
Black | 24,890 | 10min @80°C | 3 | 6 |
| FH8636L | Very fast curing Medium viscosity, low bleeding Excellent thermal performance |
Black | 17,000 | 10min @80°C | 3 | 6 |
| FH8643 | Low coefficient of thermal expansion Low curing shrinkage High temperature/high humid resistance |
Black | 16,500 | 30min @ 100°C 60min @ 90°C |
3 | 6 |
| Heat Cure Adhesive |
Description | Color | Viscosity @ 25°C(cPs) |
Cure Schedule | Tg (°C) |
CTE alpha 1 ppm |
Pot Life @ 25°C(days) |
Shelf Life @ -20°C (months) |
|---|---|---|---|---|---|---|---|---|
| FH8006 | Designed for high reliability portable devices Fast flow performance |
Black | 480 | 8min @130°C | 99 | 65 | 72 | 6 @ -20°C |
| FH8009 | Designed for high reliability portable devices Fast flow performance Reworkable |
Black | 627 | 8min @130°C | 96 | 58 | 72 | 6 @ -20°C |
| FH8020 | SMD protection on high density PCBA Low modulussand soft material Fast cure, Low shrinkage |
Black | 13,000 | 8min @150°C | 1.6 | 78 | 72 | 6 @ -20°C |
| FH8028 | Reworkable without damage to the attach pad High reliability design for portable device |
Black | 400 | 8min @150°C | 125 | 55 | 72 | 6 @ -20°C |
| FH8029 | High reliability, fast flow CSP underfill | Black | 600 | 8min @150°C | 125 | 55 | 72 | 6 @ -20°C |
| FH8313 | Fast cure at moderate temperature minimizing stress on components Reworkable without damage to the attach pad |
Black | 4,800 | 8min @150°C | 166 | 29 | 24 | 6 @ -20°C |
| FH8050 | Designed for edge bond application Self-alignment in lead-free reflow Good degassing performance and shape retention |
Black | Thixotropic | Compatible with lead-free profile |
115 | 81 | 8 | 6 @ 2-8°C |
| FH8707HF | BGA side fill application Capability in narrow edge CSP or WLCSP |
Black | 340,000 | 120s @ 120°C 90s @ 150°C |
105 | 67 | 8 | 6 @ 2-8°C |
| FH8708T | Good dispensing performance and shape retention Low CTE Good reliability |
Black | 41,280 | 5min @120°C | 163 | 24 | 8 | 6 @ 2-8°C |
| FH8730 | Excellent toughness and bonding strength. Halogen free Good mechanical properties and good reliability properties |
White | 6,600 | 30min @ 150°C 10min @ 180°C |
122 | 70 | 48 | 6 @ 2-8°C |
| FH8731 | Designed for wirebond chip glob top High flow material |
Black | 36,400 | 20min @150°C | 129 | 58 | 72 | 12 @ 2-8°C |
| FH8732 | Designed for wirebond chip glob top High flow material Low CTE |
Black | 35,000 | 30min @ 125°C + 90min @ 125°C |
95 | 17 | 8 | 6 @ -40°C |
| FH8733 | Designed for wirebond chip glob top Medium flow material Low glob-top |
Black | 90,000 | 90min @120°C | 124 | 42 | 72 | 6 @ 2-8°C |
| FH8733L | Designed for wirebond chip glob top Low elastic modulus Low coefficient |
Black | 45,000 | 60min @ 130°C 90min @ 120°C |
122 | 43 | 72 | 6 @ 2-8°C |