H.B. Fuller Encapsulant solutions
Today's consumers demand smaller devices with more features, greater reliability, and lower costs. H.B. Fuller provides a range of solutions tailored to meet all aspects of customer requirements in circuit board manufacturing across various industries. Our solutions aim to enhance the reliability and service life of circuit boards while ensuring excellent component protection.
H.B. Fuller offers a range of adhesive options with the same chemistry to meet a variety of application requirements.
H.B. Fuller’s PCB assembly products typically：
- High reliability and excellent aging resistance
- Thermal shock
- Low shrinkage, low CTE
- Easy processing
- Reworkability versus reliability balance
- Excellent flux compatibility
- Good SIR (Surface Insulation Resistance)
Typical applications areas PCB assembly products are：
- Wafer Level Chip Scale Packages (WLCSP)
- Ball Grid Array (BGA)
- Chip Scales Packages (CSPs)
- Wire bonded die
- Consumer electronic cables and accessories
- PCB
- FPC
Device reliability is a crucial factor in determining product performance within the electronics industry, whether it's for consumer or industrial assembly applications. H.B. Fuller offers a range of high-performance underfill and edgebond materials that provide dependable structural reinforcement for sensitive device components. Our solutions also offer balanced reworkability, tailored to meet specific customer requirements.