H.B. Fuller Potting Compounds
Today's consumers want smaller devices, more features, great reliability, and of course, lower costs. H.B. Fuller offers a variety of solutions designed to meet all aspects of customer requirements in circuit board manufacturing in a variety of industries. Improve the reliability and service life of the circuit board, and provide good protection for components.
H.B. Fuller’s PCB assembly products typically：
- High reliability and excellent aging resistance
- Thermal shock
- Low shrinkage, low CTE
- Easy processing
- Reworkability versus reliability balance
- Excellent flux compatibility
- Good SIR (Surface Insulation Resistance)
Typical applications areas PCB assembly products are：
- Wafer Level Chip Scale Packages (WLCSP)
- Ball Grid Array (BGA)
- Chip Scales Packages (CSPs)
- Wire bonded die
- Consumer electronic cables and accessories
- PCB
- FPC
Environmental protection of circuits and individual components is necessary to ensure that device integrity and reliability is maintained throughout the operating life of the electronic device. Our conformal coating and encapsulation and potting materials are used to meet a wide range of customer board protection requirements – consumer device to military aerospace applications. These CBP products use a range of different resin and cure chemistries to deliver environmental protection.