H.B. Fuller PCB Underfill Solutions
Today's consumers want smaller devices, more features, great reliability, and of course, lower costs. H.B. Fuller offers a variety of solutions designed to meet all aspects of customer requirements in circuit board manufacturing in a variety of industries. Improve the reliability and service life of the circuit board, and provide good protection for components.
H.B. Fuller’s PCB assembly products typically：
- High reliability and excellent aging resistance
- Thermal shock
- Low shrinkage, low CTE
- Easy processing
- Reworkability versus reliability balance
- Excellent flux compatibility
- Good SIR (Surface Insulation Resistance)
Typical applications areas PCB assembly products are：
- Wafer Level Chip Scale Packages (WLCSP)
- Ball Grid Array (BGA)
- Chip Scales Packages (CSPs)
- Wire bonded die
- Consumer electronic cables and accessories
- PCB
- FPC
Device reliability is a critical measure of product performance in the electronics industry, whether the application is for consumer of industrial assembly applications. H.B. Fuller range of high-performance underfill and edgebond materials offer reliable structural reinforcement of sensitive device components as well as balanced re-workability, depending on specific customer requirements
H.B. Fuller’ Underfill solutions
| Product | Description | Chemistry | Color | Cure Schedule | Hardness (Shore) | Shelf Life @ 8-25°C (months) |
|---|---|---|---|---|---|---|
| H.B. Fuller FH8006 | Designed for high reliability portable devices | Fast flow | Black | 8 min @ 130°C | 99 | 6 @ -20°C |
| H.B. Fuller FH8009 | Designed for high reliability portable devices | Fast flow | Black | 8 min @ 130°C | 96 | 6 @ -20°C |
| H.B. Fuller FH8020 | SMD protection on high density PCBA Low modulusand soft material Fast cure, Low shrinkage |
Black | 13,000 | 8 min @ 150°C | 1.6 | 6 @ -20°C |
| H.B. Fuller FH8028 | High reliability design for portable device e Reworkable without damage to the attach pad |
Black | 400 | 8 min @ 150°C | 125 | 6 @ -20°C |
| H.B. Fuller FH8029 | Black | 600 | 8 min @ 150°C | 125 | 6 @ -20°C | |
| H.B. Fuller FH8311 | High Tg, low CTE Fast cure at moderate temperature mininizing stress on components Repairable without damage to the attach pa |
Black | 19,900 | 120 min @ 165°C | 122 | 8 |
| H.B. Fuller FH8313 | Fast cure at moderate temperature minimizing stress on components Reworkable without damage to the attach pad |
Black | 3,400 | 120 min @ 165°C | 120 | 8 |