Epoxy Adhesive for electronic industry
The general trend in the advance electronic materials industry is moving toward smaller, lighter, thinner, fast and more reliable products. To deliver lighter less bulky electronic devices with ever greater processing power is a significant challenge. Electronic device manufacturers need to utilize non-traditional metal, glass and plastic materials in construction of their products, which requires reduced application temperature during the assembly process. To ensure integrity and reliability throughout the working life of electronic devices, high-reliability protective products increase the life of electronic devices.
H.B. Fuller’s high performance epoxy adhesive meet current and next generation requirements in electronics field. Whether bonding to low surface energy FPC/PCB, different grades of LCP, or component protection for board level materials, you can count on us to partner with you to solve your adhesion challenges
H.B. Fuller’s products for low temperature cure applications offer：
- One part, adhesives with long work life
- Long shelf life at -20°C storage or blow
- Industry-leading, thermal cure kinetics, offering lower temperature cure
- at short cure time
- High adhesion to a variety of substrates
- High reliability and thermal resistance
- Low stress
- High elongation
- Easy to processing liquid, paste and film solutions
H.B. Fuller’s products for heat cure applications offer：
- High reliability (drop, shock, autoclave and temperature cycle)
- Fast flow and easy processing
- Reworkable versus reliability balance
- Excellent flux compatibility
- High reliability edge bond
- Good surface insulation resistance (SIR)
Low temperature cure adhesives for bonding applications are:
- Camera modules and image sensors
- Finger print sensors
- LED lens boding
- Touch panels
- Wearable device assembly
- Electrical and component assembly
Heat cure adhesives for bonding applications are:
- Wafer Level Chip Scale Package (WLCSP)
- Ball Grid Array（BGA）
- Chip Scale Packages（CSPs）
|
Low Temperature Cure Adhesive |
Description |
Color |
Viscosity @ 25°C (cPs) |
Cure Schedule |
Pot Life @ 25°C (days) |
Shelf Life @ -20°C (months) |
|
H.B. Fuller FH8602 |
High bond strength on a variety of substrates |
Black |
8,200 |
5min @ 80°C |
6 |
3 |
|
H.B. Fuller FH8620 |
Excellent thermal performance |
Black |
35,000 |
15min @ 70°C |
6 |
3 |
|
H.B. Fuller FH8621L |
Very fast curing at low temperature |
Black |
6,500 |
20min @ 80°C |
6 |
3 |
|
H.B. Fuller FH8632 |
High bond strength on a variety of substrates |
Black |
25,000 |
50min @ 70°C |
6 |
3 |
|
H.B. Fuller FH8633LV |
Ultra fast curing magnet bonding adhesive |
Black |
6,826 |
10min @ 80°C |
6 |
3 |
|
H.B. Fuller FH8633T |
Fluorescent property for easy auto optical inspection |
Black |
24,890 |
30min @ 80°C |
6 |
3 |
|
H.B. Fuller FH8633TB |
Very fast curing |
Black |
12,540 |
30min @ 80°C |
6 |
3 |
|
H.B. Fuller FH8634 |
High bond strength on a variety of substrates |
Black |
14,000 |
5min @ 80°C |
6 |
3 |
|
H.B. Fuller FH8634FC |
Excellent thermal performance |
Black |
10,880 |
10min @ 80°C |
6 |
3 |
|
H.B. Fuller FH8636 |
Low bleeding |
Black |
24,890 |
5min @ 80°C |
6 |
3 |
|
H.B. Fuller FH8636L |
Very fast curing |
Black |
17,000 |
10min @ 80°C |
6 |
3 |
|
H.B. Fuller FH8643 |
Mediem viscosity, low bleeding |
Black |
16,500 |
30min @ 100°C |
6 |
3 |
|
H.B. Fuller FH8623M |
Low coefficient of thermal expansion |
Black |
12,500 |
10min @ 75°C |
3 |
6 |
|
H.B. Fuller FH8632M |
Low curing shrinkage |
Black |
5min @ 80°C |
3 |
6 |
|
Heat Cure Adhesive |
Description |
Color |
Viscosity @ 25°C (cPs) |
Cure Schedule |
|
H.B. Fuller FH8006 |
Fast flow performance |
Black |
480 |
8min @130°C |
|
H.B. Fuller FH8009 |
Reworkable |
Black |
627 |
8min @130°C |
|
H.B. Fuller FH8020 |
SMD protection on high density PCBA |
Black |
13,000 |
8min @150°C |
|
H.B. Fuller FH8028 |
Designed for wirebond chip glob top |
Black |
340,000 |
8min @150°C |
|
H.B. Fuller FH8029 |
Designed for wirebond chip glob top |
Black |
41,280 |
120s @ 120°C |
|
H.B. Fuller FH8313 |
BGA side fill application |
Black |
6,600 |
90s @ 150°C |
|
H.B. Fuller FH8050 |
Fast cure at moderate temperature |
Black |
36,400 |
5min @120°C |
|
H.B. Fuller FH8707HF |
Good dispensing performance and shape retention |
Black |
6 @-20°C |
30min @ 150°C |
|
H.B. Fuller FH8708T |
Low CTE |
Black |
6 @2-8°C |
10min @ 180°C |
|
H.B. Fuller FH8730 |
High temperature high humid resistance |
White |
12 @2-8°C |
20min @150°C |
|
H.B. Fuller FH8731 |
Halogen free |
White |
6 @-40°C |