Printed Circuit Board (PCB) Assembly
Today's consumers want smaller devices, more features, great reliability, and of course, lower costs. H.B. Fuller offers a variety of solutions designed to meet all aspects of customer requirements in circuit board manufacturing in a variety of industries. Improve the reliability and service life of the circuit board, and provide good protection for components.
We offer a range of adhesive options with the same chemistry to meet a variety of application requirements.
|
H.B. Fuller's PCB assembly products typically |
Typical applications areas PCB assembly products are |
|---|---|
|
|
Device reliability is a critical measure of product performance in the electronics industry, whether the application is for consumer of industrial assembly applications. H.B. Fuller range of high-performance underfill and edgebond materials offer reliable structural reinforcement of sensitive device components as well as balanced re-workability, depending on specific customer requirements.
-Assembly.jpg)
Underfill
| Product | Description | Color | Viscosity @ 25°C (cPs) | Cure Schedule | Tg (°C) | CTE alpha 1: ppm | Pot Life @ 25°C (hrs) | Shelf Life (Months) |
|---|---|---|---|---|---|---|---|---|
| FH8006 | Designed for high reliability portable devices Fast flow performance |
Black | 480 | 8 min @ 130°C | 99 | 65 | 72 | 6 @ -20°C |
| FH8009 | Designed for high reliability portable devices Fast flow performance Reworkable |
Black | 627 | 8 min @ 130°C | 96 | 58 | 72 | 6 @ -20°C |
| FH8020 | SMD protection on high density PCBA Low modulus and soft material Fast cure, Low shrinkage |
Black | 13,000 | 8 min @ 150°C | 1.6 | 78 | 72 | 6 @ -20°C |
| FH8028 | Reworkable without damage to the attach pad High reliability design for portable device |
Black | 400 | 8 min @ 150°C | 125 | 55 | 72 | 6 @ -20°C |
| FH8029 | High reliability, fast flow CSP underfill | Black | 600 | 8 min @ 150°C | 125 | 55 | 72 | 6 @ -20°C |
| FH8311 | High Tg, low CTE Fast cure at moderate temperature minizing stress on components Repairable without damage to the attach pad |
Black | 19,900 | 120 min @ 165°C | 122 | 35 | 8 | 6 @ -40°C |
| FH8313 | Fast cure at moderate temperature minimizing stress on components Reworkable without damage to the attach pad |
Black | 3,400 | 120 min @ 165°C | 120 | 32 | 8 | 6 @ -40°C |
Edge bond material
| Product | Description | Color | Viscosity @ 25°C (cPs) | Cure Schedule | Tg (°C) | CTE alpha 1: ppm | Pot Life @ 25°C (hrs) | Shelf Life (Months) |
|---|---|---|---|---|---|---|---|---|
| FH8050 | Designed for edge bond application Self-alignment in lead-free reflow Good dispensing performance and shape retention |
Black | Thixotropic | Compatible with lead-free profile |
115 | 81 | 8 | 6 @ 2 - 8°C |
| FH8707HF | BGA side fill application Capability in narrow edge CSP or WLCSP |
Black | 340,000 | 120s @ 120°C or 90s @ 150°C |
105 | 67 | 8 | 6 @ 2 - 8°C |
| FH8708T | Good dispensing performance and shape retention Low CTE Good reliability |
Black | 41,280 | 5min @ 120°C | 163 | 24 | 8 | 6 @ 2 - 8°C |
| EA6037C | Designed for electronics reinforcement Excellent adhesion on a wide range of material |
Red to Clear | 20,000 | UV 2,400 mJ/cm² | N.A. | N.A. | N.A. | 12 @ 8 - 25°C |
Encapsulant&Others
| Product | Descriniption | Color | Viscosity @ 25°C (cPs) | Cure Schedule | Tg (°C) | CTE alpha 1: ppm | Pot Life @ 25°C (hrs) | Shelf Life (Months) |
|---|---|---|---|---|---|---|---|---|
| FH8731 | Disigned for wirebond chip glob top High flow material |
Black | 36,400 | 20min @ 150°C | 129 | 58 | 72 | 12 @ 2 - 8°C |
| FH8732 | Disigned for wirebond chip glob top High flow material Low CTE |
Black | 35,000 | 30min @ 125°C + 90min @ 165°C |
95 | 17 | 8 | 6 @ -40°C |
| FH8733 | Disigned for wirebond chip glob top Medium flow material |
Black | 90,000 | 90min @ 120°C | 124 | 42 | 72 | 6 @ 2 - 8°C |
| FH8733L | Low glob-top Low elastic modulus Low coefficient |
Black | 45,000 | 60min @130°C 90min @120°C |
122 | 43 | 72 | 6 @ 2 - 8°C |
| FS2116 | Medium viscosity Suitable for solder joint protection and thick coating |
Traslucence | 9,000 | 48h @25°C | NA | NA | NA | 6 @ 8-25°C |
| FS2117 | General purpose Suitable for sealing and component reinforncement |
White | Paste | 48h @25°C | NA | NA | NA | 6 @ 8-25°C |
| UV103 | High flexibility and toughness Good aging resistance Excellent adhesion to a wide variety of substrates |
Light Yellow | 50,000 | UV 1,500mJ/cm² (365nm) |
NA | NA | NA | 12 @ 8-25°C |
| EA6439 | Low modulus for low stress and impact resistance Good flux compatibility Good SIR performance |
Light Blue | 8,000 | UV 200mW/cm² (365nm LED) + 10min @130°C |
15 | 42 | 72 | 6 @-20°C |
Environmental protection of circuits and individual components is necessary to ensure that device integrity and reliability is maintained throughout the operating life of the electronic device. Our conformal coating and encapsulation and potting materials are used to meet a wide range of customer board protection requirements – from consumer device to military aerospace applications. These CBP products use a range of different resin and cure chemistries to deliver environmental protection.
Conformal Coating
| Product | Descriniption | Chemistry | Color | Viscosity @ 25°C (cPs) | Cure Schedule | Hardness (Shore) | Shelf Life @ 8-25°C (Months) |
|---|---|---|---|---|---|---|---|
| EA6110 | Designed for circuit board protection | Modified Acrylate | Blue | 800 | UV/Moisture UV 2,400mJ/cm² |
D 60 | 6 |
| EA6106L | Handling possible immediately after UV curing Excellent mechanical and climatic resistance Excellent protection against corrosion of PCB |
Modified Acrylate | Light Yellow (Fluorescence) | 70 | UV/Moisture UV 1,500mJ/cm² |
A 50 | 6 |
| EA6106M | Excellent dielectric and proof tracking properties Excellent for thermal shock Suitable for a variety of process requirements |
Modified Acrylate | Light Yellow (Fluorescence) | 800 | UV/Moisture UV 3,500mJ/cm² |
A 60 | 6 |
| EA6103 | Low odor, environmentally friendly Easy to rework, suitable for a variety of process requirement Excellent aging resistance |
Solvent-base Acrylate | Clear (Fluorescence) | 30 | Tack-free time: 10min @25°C Full cure time: 24h @25°C |
A 60 | 12 |
| EU2002 | Low odor, environmentally friendly Excellent chemical resistance Excellent insulating property |
Solvent-base Alkyd | Brown (Fluorescence) | 80 | Tack-free time: 30min @25°C Full cure time: 48h @25°C |
A 55 | 6 |
| FS3000 | Solvent-free Excellent weather resistatance, dielectric property Reworkable |
Silicone | Translucent (Fluorescence) | 800 | Tack-free time: 15min @25°C Full cure time: 24h @25°C |
A 25 | 6 |
Potting Compounds
| Product | Descriniption | Chemistry | Color | Viscosity @ 25°C (cPs) | Cure Schedule | Hardness (Shore) | Shelf Life @ 8-25°C (months) |
|---|---|---|---|---|---|---|---|
| FS3001B | Shallow potting Low stress Excellent thermal resistance |
Silicone | Black | 1,500 | Tack-free time: 15min @25°C Full cure time: 24h @25°C Pot life: 30min@25°C |
A 25 | 6 |
| FS3006 | 2K product, mix ratio: 1:1 (v/v) Thermal conductive 0.8W/m.K Low stress Excellent aging performance |
Silicone | Gray | A: 4,000 B: 2,000 |
Full cure time: 24h@@25°C |
A 58 | 6 |
| FH8746 | Shallow potting Cure at medium-high temperature Excellent sealing performance |
Epoxy | Black | 7,500 | 30min @80°C | D 85 | 6 @2-8°C |
| EP7062 | 2K product, mix ratio: 1:1 (v/v) Cure at room temperature, shorten cure time at heating Medium viscosity Excellent sealing performance |
Epoxy | A: Black B: Olive |
A: 11,000 B: 18,000 |
Pot life: 30min@25°C Full cure time: 48h@25°C |
D 70 | 6 |