DELO DUALBOND GE7065

DELO DUALBOND GE7065 is solvent-free and rheological, providing good control over the application process. DELO DUALBOND GE7065 requires heat curing for optimum strength, can be temporarily fixed by light, contains fillers and has a low coefficient of thermal expansion (CTE) for increased bond stability.

Technical data sheet of DELO DUALBOND GE7065

Key features of DELO DUALBOND GE7065

DELO DUALBOND GE7065 stands out with its strict compliance with RoHS Directive 2015/863/EU, ensuring safety and environmental friendliness.

In addition, DELO DUALBOND GE7065 can operate stably in a wide temperature range from -65°C to 220°C, helping to meet the strict requirements of many industrial applications.

Application of DELO DUALBOND GE7065

DELO DUALBOND products are mainly used in fields such as electronics, microelectronics, electrical engineering and mechanical engineering. The main uses of the product include bonding, fixing or packaging of components and parts. The fixing process can be carried out through a light source, in which DELOLUX curing lamps are the recommended equipment.

For maximum durability, the product must be fully cured. For areas with limited access to light or shade, an additional heat cure step may be required. Light curing is a versatile option that can be adapted to a variety of technical requirements.

Official distributor of DELO DUALBOND GE7065

Currently, Hicotech Vietnam Co., Ltd. is operating as an authorized distributor of DELO products in Vietnam. With a team of technical consultants available to answer all customer inquiries related to the product, Hicotech is committed to providing customers with high-quality products along with the best support services on the market.

Contact information:

Hotline / Zalo: 0945 261 931

Email: sale@hicotech.com.vn